fast, precise, dissipative
The requirements in electronics manufacturing are manifold. From clean gripping in clean environments to handling rigid-flex assemblies and ceramic substrates, modern electronics manufacturing places the highest demands on gripping technology. WEISS ROBOTICS has been supplying the industry with proven gripping solutions for over 15 years, from substrate handling to THT assembly to handling during end-of-line testing of electronic assemblies.
Solutions by WEISS ROBOTICS
Force-controlled, sensitive gripping to prevent damage to the components.
High precision in component pick-up and placement, robust in the event of placement errors.
Gripping modules in dissipative design prevent damage from electro-static discharges.
Thanks to preset-based configuration, gripping modules can be parameterized dynamically to cope with high part diversity.
High process reliability
Integrated gripper part detection detects feeding and depositing errors, ensuring high reliability of the test process.
Minimum quantity lubrication and sealed guides prevent operating fluids from escaping, protecting the assembly.
The assembly of wired components, also known as THT assembly, represents a major challenge in module production. Despite the high automation density in printed circuit board assembly, today wired components are mostly assembled conventionally by hand. In order to counter the increasing shortage of skilled workers, this work is being automated step by step. WEISS ROBOTICS offers smart servo grippers for THT assembly, with which the components can be precisely picked up and positioned.
In end-of-line testing, the previously equipped assemblies are electrically tested and any necessary programming is carried out. For this purpose, depending on the application, the assemblies are placed in simple test adapters or undergo a burn-in test in an oven to ensure 100% reliability. Gripping the assemblies is particularly suitable where a high packing density makes suction difficult. Gripping is also recommended with nail bed testers, where a high positioning accuracy is required.
Especially in the high-mix low-volume segment, a short setup time represents the decisive advantage. WEISS ROBOTICS offers smart servo grippers with a large stroke for robot-assisted end-of-line testing, with which even sensitive assemblies can be gripped force-controlled and safely. With its finger kit, WEISS ROBOTICS also offers the possibility to quickly and easily adapt the gripper fingers to different board sizes.
Especially important for automation with robots: use the GRIPLINK technology for smart integration of the gripper module into the robot controller. Also integrate additional sensor technology into your process via this tech and make your process more flexible, e.g. with laser sensors for position and distance measurement.
Magazine carriers are used to store electronic assemblies in a space-saving manner. Coordinated movements of the gripper system are necessary in order to insert or remove printed circuit boards with robots. With the project "GRIPPERPILLAR" WEISS ROBOTICS has shown that a conveying movement for a PCB gripped at the edge can be realized with servo grippers arranged one above the other. The advantage: no free area on the PCB needs to be provided for suction or gripping. The motion pattern is controlled via GRIPLINK technology directly from the robot controller.