Electronics manufacturing

fast, precise, dissipative

The requirements in electronics manufacturing are manifold. From clean gripping in clean environments to handling rigid-flex assemblies and ceramic substrates, modern electronics manufacturing places the highest demands on gripping technology. WEISS ROBOTICS has been supplying the industry with proven gripping solutions for over 15 years, from substrate handling to THT assembly to handling during end-of-line testing of electronic assemblies.

Solutions by WEISS ROBOTICS

Sensitive Handling

Force-controlled, sensitive gripping to prevent damage to the components.

Precise mechanics

High precision in component pick-up and placement, robust in the event of placement errors.

ESD dissipative

Gripping modules in dissipative design prevent damage from electro-static discharges.

Universally configurable

Thanks to preset-based configuration, gripping modules can be parameterized dynamically to cope with high part diversity.

High process reliability

Integrated gripper part detection detects feeding and depositing errors, ensuring high reliability of the test process.

Clean

Minimum quantity lubrication and sealed guides prevent operating fluids from escaping, protecting the assembly.

Application examples

THT assembly

The assembly of wired components, also known as THT assembly, represents a major challenge in module production. Despite the high automation density in printed circuit board assembly, today wired components are mostly assembled conventionally by hand. In order to counter the increasing shortage of skilled workers, this work is being automated step by step. WEISS ROBOTICS offers smart servo grippers for THT assembly, with which the components can be precisely picked up and positioned.

Servo gripper IEG 55-020 ESD integrated in EPSON SCARA robot via GRIPLINK Technology.
Testing of Electronic assemblies

 

During End-of-Line testing, the previously assembled assemblies (electronic/mechatronic) are electrically tested and any necessary programming is carried out. Depending on the application, the assemblies are either inserted into simple test adaptors or put through their paces in an oven during a burn-in test. Gripping assemblies is particularly useful where, for example, high packing density makes suction difficult, and in the case of nail-bed testers, where high positioning accuracy is required.

Particularly in the High Mix Low Volume sector, a short set-up time represents a decisive advantage. For robot-assisted End-of-Line testing, Weiss Robotics offers smart servo-electric grippers with a long stroke, which can be used to grip even sensitive assemblies safely and with force control. With the Fingerkit, WEISS ROBOTICS also offers the option of adapting the gripper fingers quickly and easily to different PCB sizes.

Particularly important for robot-based automation: use GRIPLINK technology for the smart integration of the gripping module into the robot controller. You can also use this to incorporate additional sensors into your process and increase its flexibility, for example with laser sensors for position and distance measurement.

 

IEG 55-020 ESD integrated in KUKA KR3 robot via GRIPLINK technology.
Handling of electronic assemblies

Magazine carriers are used to store electronic assemblies in a space-saving manner. Coordinated movements of the gripper system are necessary in order to insert or remove printed circuit boards with robots. With the project "GRIPPERPILLAR" WEISS ROBOTICS has shown that a conveying movement for a PCB gripped at the edge can be realized with servo grippers arranged one above the other. The advantage: no free area on the PCB needs to be provided for suction or gripping. The motion pattern is controlled via GRIPLINK technology directly from the robot controller.

Handling of PCBs using "Gripperpillar". Servo grippers used: IEG 55-020/IEG 76-030.